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Thermal Electronics Design Engineer
This job has expired, and cannot be applied for.
- Posted By: i4 Recruitment Account
- Address:
- Date Posted: 8th Mar 2010
- Salary: £33000 - £38000 per annum + Health Insurance, Pension Scheme
- Location: Colchester
- Reference Code: i4R-T0301
- Views Since Posting: 269
- Full Description:
Location: Colchester
My client is a world leader in the design and development of high performance computer products based on Intel CPU technology.
ROLE:
Further expansion of their development activities means that they need a Thermal Electronics Design Engineer who can design and prove the thermal and mechanical elements of their single board computer products.
The Thermal Electronics Design Engineer will work closely with the electronics and board layout engineers at all the different stages of board development, for both rugged and more benign environments. The design team operates in a small company environment, which means that each design is completed by an individual engineer. As a result, each engineer rapidly becomes involved with all aspects of the product design and development. Short design timescales are an important part of the development strategy, which also result in our engineers being involved in many different product designs quite quickly.
ESSENTIAL SKILLS/EXPERIENCE:
a) Established Thermal Electronics / Mechanical Design Engineer
b) Educated to graduate level and with experience of designing thermal and mechanical solutions for electronic products in harsh environments
c) In all cases, you need to demonstrate an ability to design cost-effective and compact solutions which have excellent thermal transfer characteristics
d) You must be independent and a self-starter, able to plan and carry out your work with little supervision and with the ability to deliver effective results in short timescales
DESIRABLE SKILLS/EXPERIENCE:
a) Experience with bus-based modular boards, products dissipating 60W or more and BGA packaged electronic components.
b) Familiarity with VME or CompactPCI bus systems would be beneficial.
c) Practical experience of the thermal and mechanical issues involved in designing for rugged environments such as airborne or ground vehicle mounted equipment would be a significant advantage
d) Familiarity with SolidWorks for mechanical design, and CF Design for thermal analysis.
Benefits: Optional stakeholder pension scheme (with a generous company contribution) and life assurance. Private health insurance. Relocation allowance.
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